CHR® Pressure Sensitive Adhesive Tapes
CHR® Pressure Sensitive Adhesive Tapes
North America
Applications
CHR® electronic assembly and fabrication tapes

Electronic Assembly & Fabrication

CHR® Tape Uses for Electronic Assembly and Fabrication

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The leader in electronic assembly and fabrication tapes, providing a variety of materials, colors, adhesive systems, substrates, adhesion and tensile strengths, and more.

Select the link for product details and physical properties of CHR® adhesive tapes for electronic tape applications.

 

 

 

 

 

 




Features and Benefits
  • Prevents plating solution undercutting
  • No adhesive residue
  • Stands up to multiple operating cycles
  • Greater operator safety
  • No rework required
  • Excellent temperature and chemical resistance


 

CHR® Tape Products for Electronic Assembly and Fabrication
  • Tin Lead Stripping Plating Tape
     
    M717
Plating tape M717 is specifically designed for Gold Tab Plating operations to mask off circuitry above the contact fingers.  M717 has a thick and conformable adhesive, which prevents leakage from stripping and plating chemicals.  This product is used in the most demanding applications requiring high performance and close tolerances.  M717 is specially cured and will not leave an adhesive residue, eliminating costly clean-ups.  M716, which protects circuitry from caustic fumes, is an excellent complement to M717, and is attached above M717 on the circuit board during the plating process.  M717 is available in red.
  • Fume Protection Tape
     

    M716
Fume protection tape M716 protects the circuitry from chemical splashes and fumes during Gold Tap Plating operations.  This cost-effective, low-adhesion tape has excellent chemical and high-temperature resistance.  Generally, M716 is used with tin lead stripping plating tape M717 during plating operations.  M716 is available in violet.
  • Solder Masking Over Bare Copper (SMOBC)  Tape
     

    M803
M803 is designed for use in SMOBC processes.  It is used in combination with a pre-applied protective solder mask and provides full protection to the exposed holes in the board.  M803 is applied at the plating line by either automated equipment or by hand, and serves as a failsafe line of demarcation at the connector tabs.  The tape is used in conjunction with three process options:  (1) plating gold over bare copper circuitry, (2) plating gold over bare copper circuitry after solder mask is applied and (3) plating gold after solder mask application and solder leveling.  The tape is constructed of silicone adhesive and polyester backing.  M803 is easily removed and leaves no adhesive residue, eliminating re-work.  M803 is available in blue.
M734 and M788 are low cost substitutes for dry film in multi-layer processing to protect copper.  The tapes using natural rubber adhesives save as much as half the cost compared to silicone-based products.  M788 is specially designed for thin core boards and flexible circuitry.  Both tapes withstand high temperatures and chemicals.  M734 is available in orange, and M788 is available in aqua.
  • Hot Air Leveling (HAL) Tape
     

    C663
C663 is applied to mask gold fingers, tab areas, and other sections of printed circuit boards during the hot air leveling process. C663 uses a silicone adhesive for the most demanding HAL applications.  C663 adhesive is specially formulated to hold down and protect the gold fingers during rigorous HAL operations, yet remove cleanly from the board without splitting or leaving adhesive residue.  Its thin construction reduces the damning at the solder/tape butt line and is a proven, effective mask in double wrap applications.  These features provide lower labor costs for cleaning and increase product line efficiency.  C663 is available in yellow.
K290ESD is constructed to fill the requirements of a high performance Thermoplastic (Polyimide Backing Materials).  K290ESD has excellent electrostatic discharge properties.  The ESD additive reduces the electrostatic discharge that occurs upon tape removal.  K290ESD can safely and cleanly be removed from printed circuit boards.  The proprietary adhesive system provides high electrostatic dissipation without sacrificing adhesive strength at extreme temperatures.  K290ESD offers excellent mechanical and electrical properties.  K290ESD is available with or without a liner.


 

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